TYPE | DESCRIPTION |
Factory Lead Time | 15 Weeks |
Package / Case | 416-LFBGA |
Surface Mount | YES |
Operating Temperature | 0°C~70°C TA |
Packaging | Tray |
Series | i.MX50 |
Published | 2008 |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 416 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.05V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MCIMX507 |
JESD-30 Code | S-PBGA-B416 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 1.15V |
Supply Voltage-Min (Vsup) | 0.95V |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Core Processor | ARM® Cortex®-A8 |
Clock Frequency | 800MHz |
Supply Current-Max | 628mA |
Boundary Scan | YES |
RAM (words) | 131072 |
Voltage - I/O | 1.2V 1.875V 2.775V 3.0V |
Ethernet | 10/100Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR, LPDDR2, DDR2 |
USB | USB 2.0 + PHY (2) |
Additional Interfaces | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | Boot Security, Cryptography, Secure JTAG |
Display & Interface Controllers | LCD |
Length | 13mm |
Height Seated (Max) | 1.52mm |
RoHS Status | ROHS3 Compliant |