TYPE | DESCRIPTION |
Factory Lead Time | 12 Weeks |
Package / Case | 256-BBGA |
Surface Mount | YES |
Operating Temperature | -40°C~100°C TA |
Packaging | Tray |
Series | MPC8xx |
Published | 1999 |
JESD-609 Code | e0 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
ECCN Code | 5A992 |
Terminal Finish | TIN LEAD |
HTS Code | 8542.31.00.01 |
Subcategory | Microprocessors |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 245 |
Supply Voltage | 1.8V |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | MPC870 |
JESD-30 Code | S-PBGA-B256 |
Supply Voltage-Max (Vsup) | 1.9V |
Power Supplies | 1.83.3V |
Supply Voltage-Min (Vsup) | 1.7V |
Speed | 133MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Bit Size | 32 |
Address Bus Width | 32 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 32 |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 3.3V |
Ethernet | 10/100Mbps (2) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | DRAM |
USB | USB 2.0 (1) |
Additional Interfaces | I2C, PCMCIA, SPI, TDM, UART |
Co-Processors/DSP | Communications; CPM |
Length | 23mm |
Height Seated (Max) | 2.54mm |
RoHS Status | Non-RoHS Compliant |