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| TYPE | DESCRIPTION |
| Manufacturer Part Number: | TJA1055T/3/C,512 |
| Brand Name: | NXP Semiconductor |
| Rohs Code: | Yes |
| Part Life Cycle Code: | End Of Life |
| Ihs Manufacturer: | NXP SEMICONDUCTORS |
| Part Package Code: | SOIC |
| Package Description: | SOP, |
| Pin Count: | 14 |
| Manufacturer Package Code: | SOT108-1 |
| Reach Compliance Code: | compliant |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | NXP Semiconductors |
| Risk Rank: | 6.36 |
| JESD-30 Code: | R-PDSO-G14 |
| JESD-609 Code: | e4 |
| Length: | 8.65 mm |
| Moisture Sensitivity Level: | 3 |
| Number of Functions: | 1 |
| Number of Terminals: | 14 |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | SOP |
| Package Shape: | RECTANGULAR |
| Package Style: | SMALL OUTLINE |
| Peak Reflow Temperature (Cel): | 260 |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 1.75 mm |
| Supply Voltage-Nom: | 5 V |
| Surface Mount: | YES |
| Telecom IC Type: | INTERFACE CIRCUIT |
| Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form: | GULL WING |
| Terminal Pitch: | 1.27 mm |
| Terminal Position: | DUAL |
| [email protected] Reflow Temperature-Max (s): | 30 |
| Width: | 3.9 mm |
