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| TYPE | DESCRIPTION |
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA, FCBGA |
| Operating Temperature | -20°C~105°C TJ |
| Packaging | Tray |
| Series | i.MX6QP |
| Published | 2002 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| HTS Code | 8542.39.00.01 |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 4 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, DDR3L, DDR3 |
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
| Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
