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| TYPE | DESCRIPTION |
| Factory Lead Time | 22 Weeks |
| Package / Case | 621-FBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~105°C TA |
| Published | 2015 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 621 |
| ECCN Code | 5A992 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B621 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Speed | 800MHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4 |
| Bit Size | 64 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1V 1.8V 3.3V |
| Ethernet | 1Gbps |
| Number of Cores/Bus Width | 4 Core 64-Bit/1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | DDR3, DDR3L, LPDDR2 |
| Additional Interfaces | I2C, SPI, PCI, UART |
| Co-Processors/DSP | Multimedia; NEON™ MPE |
| Security Features | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG |
| Display & Interface Controllers | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU |
| Length | 17mm |
| Height Seated (Max) | 2.44mm |
| RoHS Status | ROHS3 Compliant |
