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| TYPE | DESCRIPTION |
| Factory Lead Time | 20 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2003 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Subcategory | Other Telecom ICs |
| Technology | BIPOLAR |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| [email protected] Reflow Temperature-Max (s) | 30 |
| Base Part Number | DS21455 |
| Function | Line Interface Unit (LIU) |
| Operating Supply Voltage | 3.3V |
| Interface | LIU |
| Number of Circuits | 4 |
| Max Supply Current | 328mA |
| Data Rate | 64 kbps |
| Telecom IC Type | FRAMER |
| Length | 27mm |
| Width | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
