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| TYPE | DESCRIPTION |
| Source Content uid: | AFV10700HSR5 |
| Manufacturer Part Number: | AFV10700HSR5 |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Package Description: | FLATPACK, R-CDFP-F4 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| Date Of Intro: | 2017-05-28 |
| Manufacturer: | NXP Semiconductors |
| Risk Rank: | 2.34 |
| Case Connection: | SOURCE |
| Configuration: | COMMON SOURCE, 2 ELEMENTS |
| DS Breakdown Voltage-Min: | 105 V |
| FET Technology: | METAL-OXIDE SEMICONDUCTOR |
| Feedback Cap-Max (Crss): | 1.16 pF |
| Highest Frequency Band: | L BAND |
| JESD-30 Code: | R-CDFP-F4 |
| Number of Elements: | 2 |
| Number of Terminals: | 4 |
| Operating Mode: | ENHANCEMENT MODE |
| Operating Temperature-Max: | 225 °C |
| Operating Temperature-Min: | -55 °C |
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Package Shape: | RECTANGULAR |
| Package Style: | FLATPACK |
| Peak Reflow Temperature (Cel): | 260 |
| Polarity/Channel Type: | N-CHANNEL |
| Power Gain-Min (Gp): | 18 dB |
| Surface Mount: | YES |
| Terminal Form: | FLAT |
| Terminal Position: | DUAL |
| Time@Peak Reflow Temperature-Max (s): | 40 |
| Transistor Application: | AMPLIFIER |
| Transistor Element Material: | SILICON |
