TYPE | DESCRIPTION |
Source Content uid: | BF824W,135 |
Manufacturer Part Number: | BF824W,135 |
Brand Name: | NXP Semiconductor |
Rohs Code: | Yes |
Part Life Cycle Code: | Transferred |
Part Package Code: | SC-70 |
Package Description: | PLASTIC, UMT3, SMD, SC-70, CMPAK-3 |
Pin Count: | 3 |
Manufacturer Package Code: | SOT323 |
Reach Compliance Code: | compliant |
HTS Code: | 8541.21.00.75 |
Manufacturer: | NXP Semiconductors |
Risk Rank: | 5.24 |
Collector Current-Max (IC): | 0.025 A |
Configuration: | SINGLE |
DC Current Gain-Min (hFE): | 25 |
JESD-30 Code: | R-PDSO-G3 |
JESD-609 Code: | e3 |
Moisture Sensitivity Level: | 1 |
Number of Elements: | 1 |
Number of Terminals: | 3 |
Operating Temperature-Max: | 150 °C |
Package Body Material: | PLASTIC/EPOXY |
Package Shape: | RECTANGULAR |
Package Style: | SMALL OUTLINE |
Peak Reflow Temperature (Cel): | 260 |
Polarity/Channel Type: | PNP |
Power Dissipation-Max (Abs): | 0.2 W |
Qualification Status: | Not Qualified |
Subcategory: | Other Transistors |
Surface Mount: | YES |
Terminal Finish: | Tin (Sn) |
Terminal Form: | GULL WING |
Terminal Position: | DUAL |
Time@Peak Reflow Temperature-Max (s): | 40 |
Transistor Element Material: | SILICON |
Transition Frequency-Nom (fT): | 250 MHz |